Verkapselungsgehäuse sowie led-modul damit

Boîtier d'encapsulation et module de del équipé d'un tel boîtier

Encapsulation housing and led module with the same

Patent Citations (1)

    Publication numberPublication dateAssigneeTitle
    US-2005280014-A1December 22, 2005Samsung Electro-Mechanics Co., Ltd.Light emitting diode and fabrication method thereof

NO-Patent Citations (0)

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Cited By (0)

    Publication numberPublication dateAssigneeTitle